Plug-in Platform Metal Package for HIC
Product Details:
| Place of Origin | Jiangsu, China (Mainland) |
|---|
Detailed Product Description
metal package
Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.
Plug-in Platform Metal Package for HIC
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Company Info
Yixing City Jitai Electronics Co., Ltd.
[China (Mainland)]
[Verified Member]
City: Beijing
Province/State: Beijing
Country/Region : China (Mainland)
Business Type:Manufacturer
Online Postings: Products












