Can-flat form Metal Package
Product Details:
| Place of Origin | Jiangsu, China (Mainland) |
|---|
Detailed Product Description
Butterfly Package
Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for labeing and marking on the surface..
Material:4J29(FeNiCo) alloy/WCu alloy.
Surface plating:Ni/Au plating,selective Au plating.
Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.
Can-flat form Metal Package
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Butterfly Package, Can-flat Metal Package, metal package products from this supplier.
Company Info
Yixing City Jitai Electronics Co., Ltd.
[China (Mainland)]
[Verified Member]
City: Beijing
Province/State: Beijing
Country/Region : China (Mainland)
Business Type:Manufacturer
Online Postings: Products