Metal Package for High-power Devices
Product Details:
| Place of Origin | Jiangsu, China (Mainland) |
|---|
Detailed Product Description
Metal Package
Application areas:All kinds hybrid thick film and thin-film integrated circuits package.
Material:Steel\Copper\WCu alloy etc.
Surface plating:Ni/Au plating,selective Au plating.
Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.
Metal Package for High-power Devices
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Company Info
Yixing City Jitai Electronics Co., Ltd.
[China (Mainland)]
[Verified Member]
City: Beijing
Province/State: Beijing
Country/Region : China (Mainland)
Business Type:Manufacturer
Online Postings: Products